Nama: Semiconductor Defects in Hardware Logic with Security-Sensitive Implications

The security-sensitive hardware module contains semiconductor defects.

Informasi Umum

Detail Latar Belakang

Mode Pengenalan

Manufacturing : May be introduced due to issues in the manufacturing environment or improper handling of components, for example.
Operation : May be introduced by improper handling or usage outside of rated operating environments (temperature, humidity, etc.)

Platform yang Berlaku

Bahasa

Kelas: Not Language-Specific (Undetermined)

Sistem Operasi

Kelas: Not OS-Specific (Undetermined)

Arsitektur

Kelas: Not Architecture-Specific (Undetermined)

Teknologi

Kelas: Not Technology-Specific (Undetermined)

Konsekuensi Umum

Cakupan	Dampak	Kemungkinan
Availability Access Control	DoS: Instability Catatan: Semiconductor defects manifest as faults on chip-internal signals or registers, have the effect of inputs, outputs, or intermediate signals being always 0 or always 1, and do not switch as expected. If such faults occur in security-sensitive hardware modules, the security objectives of the hardware module may be compromised.

Mitigasi yang Memungkinkan

Phases : Testing
Phases : Operation

Catatan Pemetaan Kerentanan

Justifikasi : This CWE entry is at the Base level of abstraction, which is a preferred level of abstraction for mapping to the root causes of vulnerabilities.
Komentar : Carefully read both the name and description to ensure that this mapping is an appropriate fit. Do not try to 'force' a mapping to a lower-level Base/Variant simply to comply with this preferred level of abstraction.

Pola Serangan Terkait

CAPEC ID	Nama Pola Serangan
CAPEC-624	Hardware Fault Injection The adversary uses disruptive signals or events, or alters the physical environment a device operates in, to cause faulty behavior in electronic devices. This can include electromagnetic pulses, laser pulses, clock glitches, ambient temperature extremes, and more. When performed in a controlled manner on devices performing cryptographic operations, this faulty behavior can be exploited to derive secret key information.
CAPEC-625	Mobile Device Fault Injection Fault injection attacks against mobile devices use disruptive signals or events (e.g. electromagnetic pulses, laser pulses, clock glitches, etc.) to cause faulty behavior. When performed in a controlled manner on devices performing cryptographic operations, this faulty behavior can be exploited to derive secret key information. Although this attack usually requires physical control of the mobile device, it is non-destructive, and the device can be used after the attack without any indication that secret keys were compromised.

Referensi

REF-1067

Why Chips Die
Brian Bailey.
https://semiengineering.com/why-chips-die/

REF-1068

What causes semiconductor devices to fail
V. Lakshminarayan.
Original

Pengajuan

Nama	Organisasi	Tanggal	Tanggal rilis	Version
Arun Kanuparthi, Hareesh Khattri, Parbati Kumar Manna, Narasimha Kumar V Mangipudi	Intel Corporation	2020-02-12 +00:00	2020-02-24 +00:00	4.0

Modifikasi

Nama	Organisasi	Tanggal	Komentar
CWE Content Team	MITRE	2020-08-20 +00:00	updated Modes_of_Introduction, Related_Attack_Patterns
CWE Content Team	MITRE	2022-06-28 +00:00	updated Relationships
CWE Content Team	MITRE	2023-01-31 +00:00	updated Related_Attack_Patterns, Relationships
CWE Content Team	MITRE	2023-04-27 +00:00	updated Description, References, Relationships
CWE Content Team	MITRE	2023-06-29 +00:00	updated Mapping_Notes
CWE Content Team	MITRE	2025-12-11 +00:00	updated Common_Consequences, Description, Weakness_Ordinalities
CWE Content Team	MITRE	2026-10-28 +00:00	updated Background_Details, Common_Consequences, Description

Detail CWE-1248

CWE-1248