CWE-1248
Semiconductor Defects in Hardware Logic with Security-Sensitive Implications
2020-02-24
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指定 CWE 通知
掌握特定 CWE 的任何變更。
名稱: Semiconductor Defects in Hardware Logic with Security-Sensitive Implications
The security-sensitive hardware module contains semiconductor defects.
一般資訊
背景詳情
引入方式
Manufacturing : May be introduced due to issues in the manufacturing environment or improper handling of components, for example.Operation : May be introduced by improper handling or usage outside of rated operating environments (temperature, humidity, etc.)
適用平台
程式語言
類別： Not Language-Specific (Undetermined)作業系統
類別： Not OS-Specific (Undetermined)架構
類別： Not Architecture-Specific (Undetermined)技術
類別： Not Technology-Specific (Undetermined)常見後果
| 範圍 | 影響 | 可能性 |
|---|---|---|
| Availability Access Control | DoS: Instability 注意：Semiconductor defects manifest as faults on chip-internal signals or registers, have the effect of inputs, outputs, or intermediate signals being always 0 or always 1, and do not switch as expected. If such faults occur in security-sensitive hardware modules, the security objectives of the hardware module may be compromised. |
潛在緩解措施
Phases : TestingPhases : Operation
漏洞對應備注
理由說明 : This CWE entry is at the Base level of abstraction, which is a preferred level of abstraction for mapping to the root causes of vulnerabilities.備註 : Carefully read both the name and description to ensure that this mapping is an appropriate fit. Do not try to 'force' a mapping to a lower-level Base/Variant simply to comply with this preferred level of abstraction.
相關攻擊模式
| CAPEC ID | 攻擊模式名稱 |
|---|---|
| CAPEC-624 | Hardware Fault Injection
The adversary uses disruptive signals or events, or alters the physical environment a device operates in, to cause faulty behavior in electronic devices. This can include electromagnetic pulses, laser pulses, clock glitches, ambient temperature extremes, and more. When performed in a controlled manner on devices performing cryptographic operations, this faulty behavior can be exploited to derive secret key information. |
| CAPEC-625 | Mobile Device Fault Injection
Fault injection attacks against mobile devices use disruptive signals or events (e.g. electromagnetic pulses, laser pulses, clock glitches, etc.) to cause faulty behavior. When performed in a controlled manner on devices performing cryptographic operations, this faulty behavior can be exploited to derive secret key information. Although this attack usually requires physical control of the mobile device, it is non-destructive, and the device can be used after the attack without any indication that secret keys were compromised. |
參考資料
REF-1067
Why Chips DieBrian Bailey.
https://semiengineering.com/why-chips-die/
REF-1068
What causes semiconductor devices to failV. Lakshminarayan.
Original
提交
| 名稱 | 機構 | 日期 | 發布日期 | Version |
|---|---|---|---|---|
| Arun Kanuparthi, Hareesh Khattri, Parbati Kumar Manna, Narasimha Kumar V Mangipudi | Intel Corporation | 4.0 |
修改記錄
| 名稱 | 機構 | 日期 | 備註 |
|---|---|---|---|
| CWE Content Team | MITRE | updated Modes_of_Introduction, Related_Attack_Patterns | |
| CWE Content Team | MITRE | updated Relationships | |
| CWE Content Team | MITRE | updated Related_Attack_Patterns, Relationships | |
| CWE Content Team | MITRE | updated Description, References, Relationships | |
| CWE Content Team | MITRE | updated Mapping_Notes | |
| CWE Content Team | MITRE | updated Common_Consequences, Description, Weakness_Ordinalities | |
| CWE Content Team | MITRE | updated Background_Details, Common_Consequences, Description |
