CWE-1248
Semiconductor Defects in Hardware Logic with Security-Sensitive Implications
Incomplete
2020-02-24
00h00 +00:00
00h00 +00:00
2025-12-11
00h00 +00:00
00h00 +00:00
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Nombre: Semiconductor Defects in Hardware Logic with Security-Sensitive Implications
The security-sensitive hardware module contains semiconductor defects.
Informaciones generales
Modos de introducción
Manufacturing : May be introduced due to issues in the manufacturing environment or improper handling of components, for example.Operation : May be introduced by improper handling or usage outside of rated operating environments (temperature, humidity, etc.)
Plataformas aplicables
Lenguaje
Class: Not Language-Specific (Undetermined)Sistemas operativos
Class: Not OS-Specific (Undetermined)Arquitecturas
Class: Not Architecture-Specific (Undetermined)Tecnologías
Class: Not Technology-Specific (Undetermined)Consecuencias comunes
| Alcance | Impacto | Probabilidad |
|---|---|---|
| Availability Access Control | DoS: Instability Note: If such faults occur in security-sensitive hardware modules, the security objectives of the hardware module may be compromised. |
Mitigaciones potenciales
Phases : TestingPhases : Operation
Notas de mapeo de vulnerabilidades
Justificación : This CWE entry is at the Base level of abstraction, which is a preferred level of abstraction for mapping to the root causes of vulnerabilities.Comentario : Carefully read both the name and description to ensure that this mapping is an appropriate fit. Do not try to 'force' a mapping to a lower-level Base/Variant simply to comply with this preferred level of abstraction.
Patrones de ataque relacionados
| CAPEC-ID | Nombre del patrón de ataque |
|---|---|
| CAPEC-624 | Hardware Fault Injection
The adversary uses disruptive signals or events, or alters the physical environment a device operates in, to cause faulty behavior in electronic devices. This can include electromagnetic pulses, laser pulses, clock glitches, ambient temperature extremes, and more. When performed in a controlled manner on devices performing cryptographic operations, this faulty behavior can be exploited to derive secret key information. |
| CAPEC-625 | Mobile Device Fault Injection
Fault injection attacks against mobile devices use disruptive signals or events (e.g. electromagnetic pulses, laser pulses, clock glitches, etc.) to cause faulty behavior. When performed in a controlled manner on devices performing cryptographic operations, this faulty behavior can be exploited to derive secret key information. Although this attack usually requires physical control of the mobile device, it is non-destructive, and the device can be used after the attack without any indication that secret keys were compromised. |
Referencias
REF-1067
Why Chips DieBrian Bailey.
https://semiengineering.com/why-chips-die/
REF-1068
What causes semiconductor devices to failV. Lakshminarayan.
Original
Envío
| Nombre | Organización | Fecha | Fecha de lanzamiento | Version |
|---|---|---|---|---|
| Arun Kanuparthi, Hareesh Khattri, Parbati Kumar Manna, Narasimha Kumar V Mangipudi | Intel Corporation | 4.0 |
Modificaciones
| Nombre | Organización | Fecha | Comentario |
|---|---|---|---|
| CWE Content Team | MITRE | updated Modes_of_Introduction, Related_Attack_Patterns | |
| CWE Content Team | MITRE | updated Relationships | |
| CWE Content Team | MITRE | updated Related_Attack_Patterns, Relationships | |
| CWE Content Team | MITRE | updated Description, References, Relationships | |
| CWE Content Team | MITRE | updated Mapping_Notes | |
| CWE Content Team | MITRE | updated Common_Consequences, Description, Weakness_Ordinalities |
