CPE Details
Qualcomm Snapdragon SC8180X-AC Firmware
-
2023-12-07
17h43 +00:00
17h43 +00:00
2023-12-07
17h43 +00:00
17h43 +00:00
Alerte pour un CPE
Restez informé de toutes modifications pour un CPE spécifique.
CPE Name: cpe:2.3:o:qualcomm:snapdragon_sc8180x-ac_firmware:-:*:*:*:*:*:*:*
Informations
Vendor
qualcommProduct
snapdragon_sc8180x-ac_firmwareVersion
-Related CVE
| CVE ID | Publié | Description | Score | Gravité |
|---|---|---|---|---|
| Transient DOS while parsing WPA IES, when it is passed with length more than expected size. | 7.5 |
Haute |
||
| Transient DOS when processing a NULL buffer while parsing WLAN vdev. | 7.5 |
Haute |
||
| Memory corruption when processing cmd parameters while parsing vdev. | 8.4 |
Haute |
||
| Memory corruption in BT controller while parsing debug commands with specific sub-opcodes at HCI interface level. | 7.8 |
Haute |
||
| Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE. | 6.5 |
Moyen |
||
| Memory corruption while loading an ELF segment in TEE Kernel. | 8.8 |
Haute |
||
| Memory corruption in UTILS when modem processes memory specific Diag commands having arbitrary address values as input arguments. | 7.8 |
Haute |
||
| Memory corruption in MPP performance while accessing DSM watermark using external memory address. | 7.8 |
Haute |
||
| Memory Corruption in SPS Application while exporting public key in sorter TA. | 7.8 |
Haute |
